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[Electronics] High quality TEM lamella preparation with Xe ion beam

[Electronics] High quality TEM lamella preparation with Xe ion beam

[Electronics] Automated TEM lamella preparation including Ar ion beam finishing

[Electronics] Automated TEM lamella preparation including Ar ion beam finishing

[Electronics] High quality TEM lamella prep of Gate Oxide using FIB-SEM-Ar Triple Beam system

[Electronics] High quality TEM lamella prep of Gate Oxide using FIB-SEM-Ar Triple Beam system

[Electronics] Fully automated TEM lamella preparation of SRAM

[Electronics] Fully automated TEM lamella preparation of SRAM

[Materials] High quality TEM lamella prep of Zirconium using FIB-SEM-Ar Triple Beam system

[Materials] High quality TEM lamella prep of Zirconium using FIB-SEM-Ar Triple Beam system

[Materials] High quality TEM lamella prep of Aluminum

[Materials] High quality TEM lamella prep of Aluminum

TEM lamella preparation with Focused Ion Beam

TEM lamella preparation with Focused Ion Beam

[Materials] High quality TEM lamella prep of Fe single crystal

[Materials] High quality TEM lamella prep of Fe single crystal

[Electronics] STEM of Barium Titanate on a FIB-SEM

[Electronics] STEM of Barium Titanate on a FIB-SEM

[Electronics] Uniformly thick TEM lamella prep of 64 layer 3D NAND

[Electronics] Uniformly thick TEM lamella prep of 64 layer 3D NAND

[Electronics] Minimizing FIB induced damage in GaN

[Electronics] Minimizing FIB induced damage in GaN

[Electronics] Automated in-situ TEM sample preparation on a FIB-SEM

[Electronics] Automated in-situ TEM sample preparation on a FIB-SEM